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B51-14 (R2019) – Boiler, pressure vessel, and pressure piping code

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ISO 4825:2023

ISO 4825:2023 Fine ceramics (advanced ceramics, advanced technical ceramics) –Test method for thermal property measurements of metalized ceramic substrates – Part 1: Evaluation of thermal resistance for use in power modules

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Description

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.

Edition

1

Published Date

2023-01-12

Status

PUBLISHED

Pages

12

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.

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