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API Technical Report TDB-6 Chapter 6 – Density

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204

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API STD 560: Fired Heaters for General Refinery Services

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324

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API MPMS CH 17.10.1: Refrigerated Light Hydrocarbon Fluids – Measurement of Cargoes on Board LNG Carries

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API RP 13B-1: Testing Water-based Drilling Fluids

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API Technical Report TDB-12 Chapter 12 – Thermal Conductivity

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API 16FI Frac Iron Guidelines and Requirements

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ISO 14575:2000

ISO 14575:2000 Information technology – Microprocessor systems – Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)

CDN $390.00

SKU: 48843a2b8f53 Category:

Description

This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).

The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.

Edition

1

Published Date

2000-07-20

Status

PUBLISHED

Pages

162

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).

The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.

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