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ISO 21456:2025

ISO 21456:2025 Determination of the residual stress of TGO layer in thermal barrier coating by photoexcitation fluorescence piezoelectric spectroscopy

CDN $125.00

This publication was last reviewed and confirmed in 2025.

Determination of the residual stress of TGO layer in thermal barrier coating by photoexcitation fluorescence piezoelectric spectroscopy

Description

This document specifies a test method for the determination of the residual stress of the TGO layer in thermal barrier coating (TBC) by photoexcitation fluorescence piezoelectric spectroscopy.

This test method specifies that there is a Cr element in the bond coat of the TBC.

This test method to determine the residual stress in the TGO layer of the TBC system is not limited by the preparation method of the TBCs. Particularly, the TBC system prepared by electron beam-physical vapour deposition (EB-PVD) has a better effect.

This method provides guidance on determining reliable estimates of residual stresses from fluorescence spectral data and estimating uncertainties in the results.

Edition

1

Published Date

2026-06-19

Status

PUBLISHED

Pages

11

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

This document specifies a test method for the determination of the residual stress of the TGO layer in thermal barrier coating (TBC) by photoexcitation fluorescence piezoelectric spectroscopy.

This test method specifies that there is a Cr element in the bond coat of the TBC.

This test method to determine the residual stress in the TGO layer of the TBC system is not limited by the preparation method of the TBCs. Particularly, the TBC system prepared by electron beam-physical vapour deposition (EB-PVD) has a better effect.

This method provides guidance on determining reliable estimates of residual stresses from fluorescence spectral data and estimating uncertainties in the results.

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