ISO 8181:2023
ISO 8181:2023 Atomic layer deposition – Vocabulary
CDN $85.00
Description
This document defines general terms and film growth processes for atomic layer deposition (ALD). ALD technique is classified into conventional time separated ALD and spatial ALD according to the separation between sequential surface reactions of precursors on substrate. Besides planar substrate, ALD can be used for coating on micro-nano particles, which is developed as powder ALD. Some energy enhanced ALD techniques are also included. This document specifies the processes of different ALD methods.
This document applies to the process of ALD. This document does not apply to the deposited materials or specific nanostructures.
This document applies to industrial production, scientific research, teaching, publishing and scientific and technological communications related to ALD.
Edition
1
Published Date
2023-10-16
Status
PUBLISHED
Pages
10
Language
English
Format
Secure PDF
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Abstract
This document defines general terms and film growth processes for atomic layer deposition (ALD). ALD technique is classified into conventional time separated ALD and spatial ALD according to the separation between sequential surface reactions of precursors on substrate. Besides planar substrate, ALD can be used for coating on micro-nano particles, which is developed as powder ALD. Some energy enhanced ALD techniques are also included. This document specifies the processes of different ALD methods.
This document applies to the process of ALD. This document does not apply to the deposited materials or specific nanostructures.
This document applies to industrial production, scientific research, teaching, publishing and scientific and technological communications related to ALD.
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