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API Technical Report TDB-6 Chapter 6 – Density

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204

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API STD 560: Fired Heaters for General Refinery Services

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API RP 13B-1: Testing Water-based Drilling Fluids

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API Technical Report TDB-12 Chapter 12 – Thermal Conductivity

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API 16FI Frac Iron Guidelines and Requirements

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ISO 4746:1977

ISO 4746:1977 Oxygen-free copper – Scale adhesion test

CDN $76.00

SKU: 8519cb27ecc2 Category:

Description

Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.

Edition

1

Published Date

1977-08-01

Status

PUBLISHED

Pages

1

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.

Previous Editions

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