ISO 4825:2023
ISO 4825:2023 Fine ceramics (advanced ceramics, advanced technical ceramics) –Test method for thermal property measurements of metalized ceramic substrates – Part 1: Evaluation of thermal resistance for use in power modules
CDN $130.00
Description
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
Edition
1
Published Date
2023-01-12
Status
PUBLISHED
Pages
12
Language
English
Format
Secure PDF
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Abstract
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
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