ISO 9453:2020
ISO 9453:2020 Soft solder alloys – Chemical compositions and forms
CDN $193.00
Description
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
Edition
4
Published Date
2020-09-24
Status
PUBLISHED
Pages
13
Language
English
Format
Secure PDF
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Abstract
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
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