
ISO/IEC 23955:2025
ISO/IEC 23955:2025 Information technology — 3D printing and scanning — Technical requirements for product data protection of an additive manufacturing service platform (AMSP)
CDN $125.00
This publication was last reviewed and confirmed in 2025.
Information technology — 3D printing and scanning — Technical requirements for product data protection of an additive manufacturing service platform (AMSP)
Description
This document specifies the technical requirements for product data protection of an additive manufacturing service platform (AMSP). The following elements are within the scope of this document.
— Classification of product data information of an AMSP and the protection levels.
— Product data protection at four data-processing stages, i.e. data collection, data display, data transfer and data deletion.
— Responsibilities and obligations of different entities.
This document is applicable when individuals or organizations (e.g. commercial enterprises, government agencies and non-profit organizations) build an AMSP or improve existing ones to provide additive manufacturing (AM) and other services specific to the submission, design, and creation of AM parts.
Edition
1
Published Date
2026-06-19
Status
PUBLISHED
Pages
9
Format 
Secure PDF
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Abstract
This document specifies the technical requirements for product data protection of an additive manufacturing service platform (AMSP). The following elements are within the scope of this document.
— Classification of product data information of an AMSP and the protection levels.
— Product data protection at four data-processing stages, i.e. data collection, data display, data transfer and data deletion.
— Responsibilities and obligations of different entities.
This document is applicable when individuals or organizations (e.g. commercial enterprises, government agencies and non-profit organizations) build an AMSP or improve existing ones to provide additive manufacturing (AM) and other services specific to the submission, design, and creation of AM parts.
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