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API RP 1173: Pipeline Safety Management Systems

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167

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API RP 1173: Pipeline Safety Management Systems : Errata 1

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0

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API RP 11S2: Electric Submersible Pump Testing: Edition 3

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API SPEC 14L: Lock Mandrels and Landing Nipples : Reaffirmed

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API SPEC 19ICD: Inflow Control Devices : Reaffirmed

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ISO 14679:1997

ISO 14679:1997 Adhesives – Measurement of adhesion characteristics by a three-point bending method

CDN $115.00

SKU: 9cacf0ae5f64 Category:

Description

This International Standard specifies a test method to determine the ability of a cured adhesive (if necessary with a primer) to adhere to a substrate with a certain surface finish, or which has been subjected to a specific surface preparation, using the “three-point bending method”.

This standard is only applicable to quality assurance and only to substrates which are rigid or resistant enough to bending, such as steel or aluminium alloys. For other substrates, the thickness is adjusted to the modulus of elasticity or a suitable stiffener is used.

The adhesive is allowed to cure without the application of pressure in order to obtain the thickness needed to provide sufficient rigidity, otherwise a bonded reinforcing piece of the same material and the same thickness as the substrate is substituted for the block of adhesive.

This test method is not suitable for film adhesives.

Edition

1

Published Date

1997-08-28

Status

PUBLISHED

Pages

11

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

This International Standard specifies a test method to determine the ability of a cured adhesive (if necessary with a primer) to adhere to a substrate with a certain surface finish, or which has been subjected to a specific surface preparation, using the "three-point bending method".

This standard is only applicable to quality assurance and only to substrates which are rigid or resistant enough to bending, such as steel or aluminium alloys. For other substrates, the thickness is adjusted to the modulus of elasticity or a suitable stiffener is used.

The adhesive is allowed to cure without the application of pressure in order to obtain the thickness needed to provide sufficient rigidity, otherwise a bonded reinforcing piece of the same material and the same thickness as the substrate is substituted for the block of adhesive.

This test method is not suitable for film adhesives.

Previous Editions

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