REGISTER

FR
Search
×
FR

Placeholder headline

This is just a placeholder headline

API RP 1173: Pipeline Safety Management Systems

$

167

BUY NOW

Placeholder headline

This is just a placeholder headline

API RP 1173: Pipeline Safety Management Systems : Errata 1

$

0

BUY NOW

Placeholder headline

This is just a placeholder headline

API RP 11S2: Electric Submersible Pump Testing: Edition 3

$

158

BUY NOW

Placeholder headline

This is just a placeholder headline

API SPEC 14L: Lock Mandrels and Landing Nipples : Reaffirmed

$

273

BUY NOW

Placeholder headline

This is just a placeholder headline

API SPEC 20F: Corrosion Resistant Bolting for Use in the Petroleum and Natural Gas Industries : Reaffirmed

$

169

BUY NOW

Placeholder headline

This is just a placeholder headline

API TR 5NCL Nickel Content Limits for API 5CT Sour Service Products

$

149

BUY NOW

Placeholder headline

This is just a placeholder headline

API SPEC 19ICD: Inflow Control Devices : Reaffirmed

$

189

BUY NOW

ISO 17178:2013

ISO 17178:2013 Adhesives – Adhesives for bonding parquet to subfloor – Test methods and minimum requirements

CDN $115.00

SKU: 4a8f083a87dd Category:

Description

ISO 17178:2013 specifies test methods for adhesives for bonding parquet and similar wood floorings to a subfloor. It also specifies the minimum requirements for shear strength, tensile strength to be achieved with these adhesives.

ISO 17178:2013 does not refer to the selection and installation of parquet floorings.

Edition

1

Published Date

2013-04-11

Status

PUBLISHED

Pages

10

Language Detail Icon

English

Format Secure Icon

Secure PDF

Abstract

ISO 17178:2013 specifies test methods for adhesives for bonding parquet and similar wood floorings to a subfloor. It also specifies the minimum requirements for shear strength, tensile strength to be achieved with these adhesives.

ISO 17178:2013 does not refer to the selection and installation of parquet floorings.

Previous Editions

Can’t find what you are looking for?

Please contact us at: